Semiconductor device and manufacturing method thereof

ABSTRACT

A semiconductor device and manufacturing method thereof improving moisture resistance of a FeRAM. After a probe test using a pad, a metal film is formed to cover the pad in an opening of a protective film and a region from the pad to an opening outer periphery of the protective film. On the metal film, a metal bump is formed. The metal film is formed to have a two-layer structure of the first and second metal films. Materials of the lower and upper layers are selected mainly in consideration of adhesion to the protective film and adhesion to the metal bump, respectively. Film formation conditions thereof are set to provide metal films with a desired quality and thickness. Thus, penetration of moisture from the pad or the periphery into a ferroelectric capacitor can be prevented and therefore, occurrence of potential inversion abnormalities due to penetrated moisture can be effectively suppressed.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a division of U.S. application Ser. No. 11/529,376,filed on Sep. 29, 2006 which is based upon and claims the benefits ofpriority from the prior Japanese Patent Application No. 2006-096633,filed on Mar. 31, 2006, the entire contents of which are incorporatedherein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device and a method formanufacturing the semiconductor device. More particularly, the presentinvention relates to a semiconductor device having a ferroelectriccapacitor and a method for manufacturing the semiconductor device.

2. Description of the Related Art

A Ferro-electric Random Access Memory (FeRAM) element using aferroelectric capacitive element (ferroelectric capacitor) as a storagecapacitive element is a non-volatile memory device having the followingcharacteristics. That is, a high-speed operation is enabled, powerconsumption is low and, writing and readout durability is excellent.

In a manufacturing process of such a FeRAM element, a continuity test ora potential inversion test of the ferroelectric substance is generallyperformed to inspect the presence of abnormalities.

On the other hand, the ferroelectric capacitor has a property of easilydeteriorating due to moisture or hydrogen (referred to as “moisture”)which penetrates from the outside.

Therefore, there is proposed a structure that a ferroelectric capacitoris covered with an aluminum oxide film to block moisture from reachingthe ferroelectric capacitor in a formation step of the FeRAM element andafter formation thereof (See, e.g., Japanese Unexamined PatentPublication No. 2005-268617).

In a continuity test or a potential inversion test of the ferroelectriccapacitor in a manufacturing process of a FeRAM element, there isgenerally used an external connection electrode pad to which a metalwire or a metal bump is finally connected. Further, a predeterminedprobe is brought into contact with the electrode pad to perform apredetermined test such as the potential inversion test of theferroelectric capacitor.

However, when a probe test is thus performed, mechanical injuries mayoccur in an electrode pad due to contact with a probe. Further, afterthe probe test, a metal wire is connected also to the electrode pad withinjuries in the same manner as in an electrode pad with no injury.

FIG. 14 schematically shows a state where in a FeRAM element, a metalwire is connected to an electrode pad after a probe test.

In FIG. 14, a FeRAM element 200 has a structure that a ferroelectriccapacitor 203 comprising a layered product including a lower electrode203 a, a ferroelectric film 203 b and an upper electrode 203 c is formedwithin an interlayer insulating film 202 formed over a semiconductorsubstrate 201.

An active element such as a transistor and passive element such as acapacitive element formed over the semiconductor substrate 201 as wellas other wiring layers provided within the interlayer insulating film202 are not shown in the figure.

The ferroelectric capacitor 203 is electrically connected to atransistor (not shown) formed using the semiconductor substrate 201 aswell as electrically connected to an electrode pad 205 through aconnection via 204 connected to the upper electrode 203 c of thecapacitor 203. The electrode pad 205 has a state of being partiallyexposed from an opening provided in a protective film 206 formed overthe pad 205.

A probe test on the FeRAM element 200 is performed using such anelectrode pad 205.

More specifically, a probe is brought into contact with the electrodepad 205 to inspect overall continuity as well as potential inversion ofthe ferroelectric capacitor 203. In such a probe test, since the probeis brought into contact with the electrode pad 205, a concave portion207 a and/or a convex portion 207 b are formed on the pad 205 as shownin the figure.

Further, after the probe test, a metal wire 208 for connecting to anexternal substrate is connected to the electrode pad 205.

However, when the concave portion 207 a and/or the convex portion 207 bare formed on the electrode pad 205, the concave portion 207 a may bepartially exposed or a gap may occur between the metal wire 208 and theelectrode pad 205 in connecting the metal wire 208 to the pad 205.

In the case where the concave portion 207 a is formed to penetratethrough the electrode pad 205 into the interlayer insulating film 202,moisture penetrates within the interlayer insulating film 202 throughthe concave portion 207 a of which the whole or a part is exposed, orthrough the gap between the metal wire 208 and the electrode pad 205.

Further, when the penetrated moisture reaches the ferroelectriccapacitor 203, the possibility is increased that an abnormality occursin the potential inversion of the capacitor 203, and as a result, theFeRAM element 200 is in danger of malfunctioning.

Herein, description is made by taking as an example a case of using theFeRAM element. Further, the problem caused by such penetration ofmoisture from the outside may similarly occur as long as thesemiconductor device having an electrode pad is used. For example, thereis a problem that migration of wiring materials easily occurs due tomoisture which penetrates into the inside through an injured electrodepad.

SUMMARY OF THE INVENTION

In view of the foregoing, it is an object of the present invention toprovide a semiconductor device having high moisture resistance and highreliability. Another object of the present invention is to provide amethod for manufacturing the semiconductor device.

To accomplish the above objects, according to one aspect of the presentinvention, there is provided a semiconductor device comprising:semiconductor substrate; an electrode pad provided over thesemiconductor substrate through an insulating film, the pad having amechanical injury; a conductive film for covering the electrode pad; andan external connection terminal connected to the conductive film.

According to another aspect of the present invention, there is provideda method for manufacturing a semiconductor device, comprising the stepsof: forming an electrode pad over a semiconductor substrate; bringing aprobe into contact with the electrode pad; covering the electrode pad toform a conductive film; and connecting an external connection terminalto the conductive film.

The above and other objects, features and advantages of the presentinvention will become apparent from the following description when takenin conjunction with the accompanying drawings which illustrate preferredembodiments of the present invention by way of example.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic sectional view showing an essential part of aFeRAM element according to a first embodiment.

FIG. 2 shows a formation flow of a FeRAM element according to a firstembodiment.

FIG. 3 is a schematic sectional view showing an essential part of aFeRAM element according to a second embodiment.

FIG. 4 is a schematic sectional view showing an essential part of aFeRAM element according to a third embodiment.

FIG. 5 is a schematic sectional view showing an essential part of aFeRAM element according to a fourth embodiment.

FIG. 6 is a schematic sectional view showing an essential part of aFeRAM element according to a fifth embodiment.

FIG. 7 is a schematic sectional view showing an essential part of aFeRAM element according to a sixth embodiment.

FIG. 8 is a schematic sectional view showing an essential part of apackaging structure according to a seventh embodiment.

FIG. 9 is a schematic sectional view showing an essential part of apackaging structure according to an eighth embodiment.

FIG. 10 is a schematic sectional view showing an essential part of apackaging structure according to a ninth embodiment.

FIG. 11 is a schematic sectional view showing an essential part of apackaging structure according to a tenth embodiment.

FIG. 12 is a schematic sectional view showing an essential part of apackaging structure according to an eleventh embodiment.

FIG. 13 is a schematic sectional view showing an essential part of apackaging structure according to a twelfth embodiment.

FIG. 14 schematically shows a state where in a FeRAM element, a metalwire is connected to an electrode pad after a probe test.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

By taking as an example a FeRAM element, preferred embodiments of thepresent invention will be described in detail below with reference tothe accompanying drawings.

A first embodiment will be first described.

FIG. 1 is a schematic sectional view showing an essential part of aFeRAM element according to the first embodiment of the presentinvention.

A FeRAM element 1 shown in FIG. 1 has a ferroelectric capacitor 4comprising a layered product including a lower electrode 4 a made ofplatinum (Pt), a ferroelectric film 4 b made of lead zirconate titanate(PZT), and an upper electrode 4 c made of iridium oxide (IrO₂) within aninterlayer insulating film 3 made of oxide silicon (SiO₂) formed over asemiconductor substrate 2.

In the FeRAM element 1, the ferroelectric capacitor 4 is electricallyconnected to a transistor (not shown) formed using the semiconductorsubstrate 2. To the element 1, a so-called stacked capacitor structureas described below is applied. That is, immediately above a conductiveplug connected to the transistor, the ferroelectric capacitor 4 isprovided to directly connect the conductive plug to the lower electrode4 a.

The ferroelectric capacitor 4 is electrically connected to an electrodepad 6 made of aluminum (Al) through a connection via 5 connected to theupper electrode 4 c. The electrode pad 6 is selectively exposed withinan opening provided in an insulating protective film 7 made of siliconnitride (SiN) formed over the pad 6.

An active element such as a transistor and passive element such as acapacitive element formed over the semiconductor substrate 2 as well asother wiring layers provided within the interlayer insulating film 3 arenot shown in the figure.

When a probe test is performed in this state, the probe is brought intocontact with the electrode pad 6, and as a result, a mechanical injurysuch as a concave portion 8 a and/or a convex portion 8 b occurs in theelectrode pad 6.

In the first embodiment, in a step between the probe test and theformation of external connection terminals such as metal wires or metalbumps, a surface of the electrode pad 6 and a region of an opening outerperiphery of a protective film 7 around the pad 6 are covered with ametal film 9 having a two-layer structure composed of first and secondmetal films 9 a and 9 b.

Further, on the electrode pad 6 having formed thereon the metal film 9,a metal bump 10 used for connection to an external substrate is formed.

The metal bump 10 can be formed, for example, using gold (Au), palladium(Pd), copper (Cu), tin (Sn), nickel (Ni) and aluminum (Al). Further, themetal bump 10 can be formed, for example, using an alloy containing lead(Pb), tin (Sn) and indium (In).

Herein, there can be adopted a structure where on the metal film 9, ametal wire formed using gold (Au), palladium (Pd) and copper (Cu) isconnected in place of the metal bump 10.

When the metal film 9 for covering the surface of the electrode pad 6and the region from the pad 6 to the opening outer periphery of theprotective film 7 is formed to have a two-layer structure, a materialfor the first lower metal film 9 a is selected particularly inconsideration of its electrical conductivity and adhesion to theprotective film 7. Examples of the metals having superior electricalconductivity and adhesion to the protective film 7 include titanium(Ti), chromium (Cr) and molybdenum (Mo).

On the other hand, a material for the second upper metal film 9 b isselected particularly in consideration of its electrical conductivityand adhesion to the metal bump 10. Examples of the metals havingsuperior electrical conductivity and adhesion to the metal bump 10include Pd, Cu, Ni and Au.

By thus covering with the metal film 9 the surface of the electrode pad6 and the region from the pad 6 to the opening outer periphery of theprotective film 7, even when the concave portion 8 a and/or the convexportion 8 b are formed in the electrode pad 6 after the probe test,penetration of moisture from such portions can be prevented by the metalfilm 9. Further, even when voids occur between the metal bump 10 and theelectrode pad 6 after the formation of the metal bump 10, penetration ofmoisture from such portions can be prevented by the metal film 9.

Subsequently, one example of a formation flow of the FeRAM element 1having the above-described structure will be described. Herein, theformation flow after formation of the metal film 9 will be mainlydescribed.

The FeRAM element formation flow according to the first embodiment isshown in FIG. 2.

In forming the metal film 9 over the electrode pad 6 of the FeRAMelement 1, a predetermined fundamental structure of the FeRAM element 1before the probe test is first formed.

More specifically, a so-called wafer process is applied as follows. Anactive element such as a transistor is formed over one main surface ofthe semiconductor substrate as well as a ferroelectric capacitor isformed in a multilayer wiring layer over the semiconductor substrate.Further, an electrode pad electrically connected to the transistor andthe ferroelectric capacitor is formed on the multilayer wiring layer(step S1). Thereafter, a protective film for covering the semiconductorsubstrate surface containing the electrode pad is formed (step S2).Further, an opening which reaches the electrode pad is formed in theprotective film (step S3).

These steps are simultaneously performed for each of a plurality of thesemiconductor elements (FeRAM elements) formed on the semiconductorsubstrate.

In such a state, a desired test is performed by bringing a needle-shapedprobe into contact with the electrode pad of the semiconductor element(step S4).

Due to contact with the probe, a mechanical injury is caused to theelectrode pad. In the present embodiment, the first metal film 9 a isformed over the whole surface including the electrode pad surface (stepS5). Further, the second metal film 9 b is formed over the film 9 a(step S6).

Herein, the first and second metal films 9 a and 9 b are formed at atemperature from 150 to 220° C. using a sputtering technique. The reasonis as follows. That is, when the film formation temperature is more than220° C., there is a possibility that memory data written in theferroelectric capacitor 4 is erased. On the other hand, when the filmformation temperature is less than 150° C., there is a high possibilitythat not a dense film which is excellent in thickness uniformity but aporous film which is permeable to moisture is formed. When the filmformation is performed in the temperature range from 150 to 220° C.,memory data of the ferroelectric capacitor 4 can be maintained as wellas the thickness uniformity and excellent film quality of the first andsecond metal films 9 a and 9 b can be secured.

Further, the first and second metal films 9 a and 9 b are formed to havethe total film thickness of 200 nm or more. Therefore, for example, evenwhen the concave portion 8 a generated after the probe test has aninverted taper cross section, that is, even when the concave portion 8 ahas a hollowed shape as viewed from the electrode pad 6 side, such aportion can be covered with the first and second metal films 9 a and 9b. Further, when the film formation temperature is set in the range from150 to 220° C. as described above, the first and second metal films 9 aand 9 b with an excellent film quality are formed even over such aninverted taper cross sectional portion.

Further, even in the case where a step between the concave portion 8 aand convex portion 8 b of the electrode pad 6 is relatively large, forexample, the step therebetween is 1 μm or more, when the first andsecond metal films 9 a and 9 b are formed to have the total filmthickness of 200 nm or more, the electrode pad 6 can be effectivelycovered.

After formation of the first and second metal films 9 a and 9 b, thefilms 9 a and 9 b are selectively etched and patterned (step S7),thereby forming the metal film 9 for covering the electrode pad 6.

On this occasion, the metal film 9 is patterned as follows. That is, anend of the film 9 is extended on the protective film 7 to make a statewhere a length of a portion of the metal film 9 covering the protectivefilm 7 is 1 m or more, preferably about 5 μm. When the length is lessthan 1 μm, an adhesion more than a fixed value cannot be secured betweenthe first lower metal film 9 a and the protective film 7, and as aresult, the metal film 9 easily peels off.

Further, the upper limit in the length of the portion which covers theprotective film 7 may be set in consideration of a size (a distancebetween the electrode pads 6) of the FeRAM 1 to be formed. When thelength of the portion which covers the protective film 7 is set to 1 μmor more, the peeling of the metal film 9 for covering the electrode pad6 is suppressed.

In the patterning by etching, side etching usually occurs at the patternedge. Therefore, the metal film 9 is easily formed to have a sizesmaller than that of a transfer pattern (a resist pattern) of a mask.Further, when the etching is performed for a laminated film composed ofthe first and second metal films 9 a and 9 b, the side etching amount ofthe first lower metal film 9 a tends to increase more than that of thesecond upper metal film 9 b. Accordingly, in consideration of occurrenceof such side etching, the patterning of the first and second metal films9 a and 9 b is performed such that a length of the portion which coversthe protective film 7 is 1 μm or more.

After the metal film 9 is thus formed, the metal bump 10 is formed onthe film 9 (step S8).

The metal bump 10 can be formed to a so-called two step-shaped bumpcomposed of, for example, a relatively large lower stage part having aroughly elliptical cross-section and an upper stage part providedprojectingly on the lower stage part. The two step-shaped bump can beformed using the following method. That is, a metal wire is connected tothe metal film 9 in a normal wire bonding manner and then, the metalwire is torn off. Alternatively, the metal wire is torn off and then, isfurther struck using a predetermined tool to make the upper stage partsmaller.

At the stage of step S8, on the metal film 9, a metal wire may beconnected in place of the metal bump 10. The metal wire can be formedusing gold (Au), copper (Cu) and palladium (Pd).

Through the above-described manufacturing process flow, the FeRAMelement 1 is formed.

As described above, in the first embodiment, the electrode pad 6 whichis surfaced within the opening formed in the protective film 7 and isinjured during a test using a probe, and the region from the electrodepad 6 to the opening outer periphery of the protective film 7 arecovered with the metal film 9 and then, the metal bump 10 is formed onthe film 9.

Therefore, even when the concave portion 8 a and/or the convex portion 8b are formed in the electrode pad 6, or even when a gap is formedbetween the electrode pad 6 and the metal bump 10, penetration ofmoisture into the inside can be prevented by the metal film 9.

By thus improving moisture resistance, penetration of moisture into theferroelectric capacitor 4 can be effectively prevented. Therefore,occurrence of the potential inversion abnormality is suppressed and as aresult, the FeRAM element 1 having high reliability can be realized.

Next, a second embodiment will be described.

FIG. 3 is a schematic sectional view showing an essential part of aFeRAM element according to the second embodiment. In FIG. 3, the sameelements as those shown in FIG. 1 are indicated by the same referencenumerals as in FIG. 1 and the detailed description is omitted.

A FeRAM element 20 according to the second embodiment has the followingstructure. That is, the electrode pad 6 which is surfaced within theopening formed in the protective film 7 and is injured during a testusing a probe, and the region from the electrode pad 6 to the openingouter periphery of the protective film 7 are covered with the metal film9. Further, a metal bump 21 with a flat surface is formed over the film9.

The FeRAM element 20 having such a structure is formed as follows. Thatis, after the probe test using the electrode pad 6, the metal film 9composed of the first and second metal films 9 a and 9 b is formed overthe electrode pad 6. Then, a film of materials for the metal bump 21 isformed to a predetermined film thickness on the whole surface. Then, theformed film is patterned to leave it on the predetermined metal film 9.

To the film formation of materials for the metal bump 21, a liquid phaseepitaxial growth method such as an electroplating method, or a PhysicalVapor Deposition (PVD) method such as a sputtering technique can beapplied. Further, the metal bump 21 is formed such that an opening ofthe protective film 7 at a formation position of the bump 21 isperfectly covered with the metal bump 21.

By thus providing the metal bump 21 with a flat surface over the metalfilm 9, the electrode pad 6 and a periphery thereof can be perfectlycovered with the metal film 9 and the metal bump 21. Therefore, evenwhen the concave portion 8 a and/or the convex portion 8 b are formed inthe electrode pad 6 after the probe test, penetration of moisture can beprevented. As a result, the FeRAM 20 having high moisture resistance andhigh reliability can be realized.

A planar shape of the metal bump 21 is not particularly limited. Thebump 21 can be formed, for example, to have a circular shape or anoblong shape.

Next, a third embodiment will be described. FIG. 4 is a schematicsectional view showing an essential part of a FeRAM element according tothe third embodiment. In FIG. 4, the same elements as those shown inFIG. 1 are indicated by the same reference numerals as in FIG. 1 and thedetailed description is omitted.

A FeRAM element 30 according to the third embodiment has the followingstructure. That is, the electrode pad 6 which is surfaced within theopening formed in the protective film 7 and is injured during a testusing a probe, and the region from the electrode pad 6 to the openingouter periphery of the protective film 7 are covered with the metal film9. Further, a solder bump 31 is formed on the film 9.

The FeRAM element 30 is formed as follows. That is, after the probe testusing the electrode pad 6, the metal film 9 composed of the first andsecond metal films 9 a and 9 b is formed over the electrode pad 6. Then,the solder bump 31 with an approximately semicircular cross section isformed on the metal film 9 using a plating method or a printing method.

For the solder bump 31, for example, an alloy mainly containing tin (Sn)as well as an alloy containing lead (Pb) or indium (In) can be used. Thesolder bump 31 is formed such that an opening of the protective film 7at a formation position of the bump 31 is perfectly covered.

By thus covering the electrode pad 6 and a periphery thereof with themetal film 9 and the solder bump 31, penetration of moisture can beprevented. As a result, the FeRAM element 30 having high moistureresistance and high reliability can be realized.

Next, a fourth embodiment will be described.

FIG. 5 is a schematic sectional view showing an essential part of aFeRAM element according to the fourth embodiment. In FIG. 5, the sameelements as those shown in FIG. 1 are indicated by the same referencenumerals as in FIG. 1 and the detailed description is omitted.

In a FeRAM element 40 according to the fourth embodiment, the electrodepad 6 which is surfaced within the opening formed in the protective film7 and is injured during a test using a probe, and the region from theelectrode pad 6 to the opening outer periphery of the protective film 7are covered with the metal film 9. Further, both ends of the metal film9 are covered with an insulating film 41.

Further, in the FeRAM element 40 according to the fourth embodiment,after the probe test using the electrode pad 6, the metal film 9 forcovering the electrode pad 6 and the region from the electrode pad 6 tothe opening outer periphery of the protective film 7 is formed over thepad 6. Further, on the metal film 9, a metal wire 42 formed using gold(Au), copper (Cu) and palladium (Pd) is connected in place of the metalbump 10 described in the first embodiment.

Thus, the insulating film 41 for covering the end of the metal film 9serves as a peeling preventive film for preventing the metal film 9 frompeeling from the protective film 7. It is preferred that in covering theend of the metal film 9, the insulating film 41 is formed to cover theend in the length from an edge of 1 μm or more. When the insulating film41 covers the end of the metal film 9 in such a length, the peeling ofthe metal film 9 from the protective film 7 is effectively prevented.

For the insulating film 41, a material such as polyimide, an epoxy resinand a phenol resin can be used. The material mainly containing theseresins can be cured at a temperature of 220° C. or less capable ofkeeping memory data in the ferroelectric capacitor 4. Further, thematerial has excellent adhesion to the protective film 7.

Accordingly, when the end of the metal film 9 is covered with theinsulating film 41 using the resins, memory data in the ferroelectriccapacitor 4 can be kept as well as peeling of the metal film 9 can beeffectively prevented. Further, such an insulating film 41, whenresin-sealing the FeRAM element 40, also plays a role in strengtheningadhesion to a sealing resin.

On the metal film 9, the metal bumps 10 and 21, or solder bump 31described in the first, second and third embodiments can also be formedin place of the metal wire 42. In such a case, the size (height) of themetal bump 10 and/or the film thickness of the insulating film 41 areappropriately adjusted to allow the metal bump 10 to partially projectfrom the surface, that is, to allow the FeRAM element 40 to be mountedthrough the metal bump 10.

Next, a fifth embodiment will be described.

FIG. 6 is a schematic sectional view showing an essential part of aFeRAM element according to the fifth embodiment. In FIG. 6, the sameelements as those shown in FIG. 1 are indicated by the same referencenumerals as in FIG. 1 and the detailed description is omitted.

In a FeRAM element 50 according to the fifth embodiment, the electrodepad 6 and the region from the electrode pad 6 to the opening outerperiphery of the protective film 7 are covered with the metal bump 51having a two-layer structure in place of being covered with the metalfilm 9.

Further, in the FeRAM element 50 according to the fifth embodiment, aninsulating film 52 made of polyimide is provided over a surface of theinsulating layer 7 other than a formation region of the metal bump 51 inorder to strengthen adhesion to the sealing resin.

The metal bump 51 in the fifth embodiment is formed as follows. That is,after the probe test using the electrode pad 6, a nickel (Ni) layer 51 ais first formed by an electroless plating method. Next, a gold (Au)layer 51 b is formed over the nickel (Ni) layer 51 a by the electrolessplating method.

The surface of the metal bump 51 has an almost flat one.

At this time, a zincate treatment as a pretreatment is performed touniformly deposit zinc (Zn) onto a portion where a plating solutioncomes in contact with the electrode pad 6 made of aluminum (Al).Thereafter, a metal such as nickel (Ni) is grown by the electrolessplating method. Thus, the metal bump 51 having excellent film qualitycan be formed.

In forming the metal bump 51 on the electrode pad 6 and on the regionfrom the pad 6 to the opening outer periphery of the protective film 7using the electroless plating method, a film thickness (a film thicknessof the portion which extends on the protective film 7) of the metal bump51 is preferably set in a range of 1 to 12 μm. Depending on thestructure of the FeRAM element 50, when the film thickness of the metalbump 51 is less than 1 μm, the metal bump 51 is not allowed to projectfrom the surface of the FeRAM element 50, or mounting of the FeRAMelement 50 becomes difficult due to the small amount of projection.

When these problems do not occur, the metal bump 51 may be formed to afilm thickness less than 1 μm. Further, the reason why the filmthickness of the metal bump 51 is set to 12 μm or less is as follows.That is, when the film thickness of the metal bump 51 is more than 12μm, an influence of stress generated during a growth process of a metalfilm by the electroless plating method increases, and as a result, theremay easily occur a problem that the metal film is peeled during thegrowth process or after the growth.

By thus perfectly covering the electrode pad 6 and the periphery thereofwith the metal bump 51, penetration of moisture can be effectivelyprevented.

Next, a sixth embodiment will be described.

FIG. 7 is a schematic sectional view showing an essential part of aFeRAM element according to the sixth embodiment. In FIG. 7, the sameelements as those shown in FIG. 1 are indicated by the same referencenumerals as in FIG. 1 and the detailed description is omitted.

In a FeRAM element 60 according to the sixth embodiment, an organicinsulating film 61 is provided over the protective film 7 excluding anopening where the electrode pad 6 is surfaced as well as excluding theouter periphery thereof. Further, after the probe test using theelectrode pad 6, the metal film 9 is formed, extending from theelectrode pad 6 through the protective film 7 to the insulating film 61.

Further, in the FeRAM element 60 according to the sixth embodiment, themetal wire 62 formed using gold (Au), copper (Cu) and palladium (Pd) isconnected on the metal film 9.

For the insulating film 61, there is used a material which can be curedat a temperature of 220° C. or less capable of keeping memory data inthe ferroelectric capacitor 4, for example, an organic material mainlycontaining polyimide, an epoxy resin or a phenol resin.

As described above, respective materials of the first and second metalfilms 9 a and 9 b of the metal film 9 are selected in consideration ofadhesion to the protective film 7 and the metal wire 62. Herein,titanium (Ti) or chromium (Cr) which can be used for the first metalfilm 9 a has a tendency to show strong adhesion to the organicinsulating film 61 made of polyimide as compared with the adhesion tothe protective film 7 made of inorganic materials such as siliconnitride (SiN).

Accordingly, by employing a structure that in response to the materialof the first metal film 9 a, the metal film 9 extends up to theinsulating film 61 as shown in FIG. 7, the insulating film 61 serves asa peeling preventive film of the metal film 9 and as a result, thepeeling of the metal film 9 can be prevented. Further, the insulatingfilm 61, when sealing the FeRAM element 60, also plays a role instrengthening adhesion to the sealing resin.

It is preferred that in allowing the metal film 9 to extend up to theend of the insulating film 61 and allowing it to ride over the film 61to cover the end of the film 61, the metal film 9 is formed to cover theend of the insulating film 61 from its edge of 1 μm or more in thewidth. As a result, the peeling of the metal film 9 from the insulatingfilm 61 can be effectively prevented.

In forming such a FeRAM element 60, the electrode pad 6 and theprotective film 7 are formed and then, an opening which reaches theelectrode pad 6 is formed in the protective film 7. Then, the organicinsulating film 61 is first formed over the whole surface and patternedinto a predetermined shape.

Thereafter, the first and second metal films 9 a and 9 b are formed overthe whole surface and patterned into a predetermined shape, therebyforming the metal film 9 having a pattern shown in FIG. 7.

Further, on the metal film 9, the metal bumps 10 and 21, or solder bump31 described in the first, second and third embodiments may be formed inplace of the metal wire 62. In such a case, the size (height) of themetal bump 10 and/or the film thickness of the insulating film 61 andthe metal film 9 must be appropriately adjusted to allow the metal bump10 to partially project from the sealing resin.

As described above, the first to sixth embodiments are described. Themetal film 9 or the metal bump 51 can be applied also to a case in whichthe concave portion 8 a and the convex portion 8 b are not formed in theelectrode pad 6 as well as to a case in which a gap 11 is absent betweenthe electrode pad 6 and the protective film 7.

There will be exemplified below a packaging structure where a FeRAMelement having the above-described structure is housed.

One of the packaging structures will be described as a seventhembodiment.

FIG. 8 is a schematic sectional view showing an essential part of thepackaging structure according to the seventh embodiment. In FIG. 8, thesame elements as those shown in the embodiments are indicated by thesame reference numerals as in the embodiments and the detaileddescription is omitted. Further, in FIG. 8, the irregularity formed inthe electrode pad 6 is not shown.

A packaging structure 70 according to the seventh embodiment has thefollowing structure. That is, the FeRAM element 1 according to the firstembodiment is mounted on an interposer (also referred to as a supportsubstrate or a wiring substrate) 71 by a flip chip (face down) method.Further, these are sealed with a sealing resin 72 such as an epoxyresin.

The interposer 71 has a structure that on the surfaces of and/or in theinsides of insulating substrates 71 a and 71 b such as a glass epoxysubstrate, wiring (not shown), an electrode pad 71 c and a connectionvia 71 d are formed.

The electrode pad 71 c is formed at a position corresponding to themetal bump 10 of the FeRAM element 1. Further, the connection via 71 dis formed such that one end thereof is connected to the electrode pad 71c directly or through wirings and the other end thereof is exposed to anopposite surface side of the pad 71 c formation surface side in theinsulating substrate.

Further, on the other end of the connection via 71 d, a solder ball 73is provided as an external connection terminal of the packagingstructure 70.

When using such a packaging structure 70 according to the seventhembodiment, there can be realized a high-performance semiconductordevice including the FeRAM element 1 with high moisture resistance andhigh reliability, in which the potential inversion abnormality iseffectively suppressed.

Herein, there is exemplified a case where the FeRAM element 1 accordingto the first embodiment is mounted on the interposer 71. Further, theFeRAM elements 20, 30 and 50 according to the second, third and fifthembodiments can be similarly mounted to form the same packagingstructure.

Further, the FeRAM element 40 according to the fourth embodiment can besimilarly mounted by changing the metal wire 42 to the metal bump 10 toform the same packaging structure.

Next, another packaging structure will be described as an eighthembodiment.

FIG. 9 is a schematic sectional view showing an essential part of thepackaging structure according to the eighth embodiment. In FIG. 9, thesame elements as those shown in FIG. 1 are indicated by the samereference numerals as in FIG. 1 and the detailed description is omitted.Further, in FIG. 9, the irregularity formed in the electrode pad 6 shownin FIG. 1 is not shown.

A packaging structure 80 according to the eighth embodiment has thefollowing structure. That is, by changing the metal bump 10 according tothe first embodiment to a metal wire 10 a, a FeRAM element 1 a ismounted on an interposer 81 by a normal face up method. Further,connection between an electrode pad section of the element 1 a and anelectrode pad on the interposer 81 is performed through wire bonding.Further, these are sealed with a sealing resin 82 such as an epoxyresin.

The interposer 81 has a structure that on the surfaces of and/or in theinsides of insulating substrates 81 a and 81 b such as a glass epoxysubstrate, a wiring 81 c formed between the substrates 81 a and 81 b aswell as a connection via 81 d of which one end is connected to thewiring 81 c is formed. On the other end of the connection via 81 d, asolder ball 83 is formed as an external connection terminal of thepackaging structure 80.

The packaging structure 80 according to the eighth embodiment isconstituted as follows. That is, connection between the electrode pad 6of the FeRAM element 1 a mounted on the interposer 81 and an electrodepad 81 e on the interposer 81 is performed through the metal wire 10 a.Then, these are sealed with the sealing resin 82.

When using such a packaging structure 80, there can be formed ahigh-performance semiconductor device including the FeRAM element 1 awith high moisture resistance and high reliability, in which thepotential inversion abnormality is effectively suppressed.

Herein, there is exemplified a case where the FeRAM element 1 a ismounted on the interposer 81 by changing the metal bump 10 in the FeRAMelement 1 shown in the first embodiment into the metal wire 10 a.Further, the FeRAM element 40 according to the fourth embodiment can besimilarly mounted to form the same packaging structure.

Next, another packaging structure will be described as a ninthembodiment.

FIG. 10 is a schematic sectional view showing an essential part of thepackaging structure according to the ninth embodiment.

In FIG. 10, the same elements as those shown in FIG. 1 are indicated bythe same reference numerals as in FIG. 1 and the detailed description isomitted. Further, the irregularity formed in the electrode pad 6 shownin FIG. 1 is not shown.

A packaging structure 90 according to the ninth embodiment has thefollowing structure. That is, the FeRAM element 1 according to the firstembodiment is mounted, for example, on the interposer 91 by the bumpjunction. Further, an underfill material 92 such as an epoxy resin isused to fill therebetween.

The interposer 91 has a structure that on the surfaces of and/or in theinsides of insulating substrates 91 a and 91 b such as a glass epoxysubstrate, an electrode pad 91 c connected to the metal bump 10 of theFeRAM element 1, a first connection via 91 d of which one end isconnected to the pad 91 c, a wiring 91 e and a second connection via 91f connected to the via 91 d through the wiring 91 e are formed.

The other end of the second connection via 91 f is exposed to themounting surface side of the FeRAM element 1. On the other end of thevia 91 f, a solder ball 93 is provided as an external connectionterminal.

When using such a packaging structure 90, there can be realized ahigh-performance semiconductor device including the FeRAM element 1 withhigh moisture resistance and high reliability, in which the potentialinversion abnormality is effectively suppressed.

Herein, there is exemplified a case where the FeRAM element 1 accordingto the first embodiment is mounted on the interposer 91. Further, theFeRAM elements 20, 30 and 50 according to the second, third and fifthembodiments can be similarly mounted to form the same packagingstructure.

Further, the FeRAM elements 40 and 60 according to the fourth and sixthembodiments can be similarly mounted by changing the metal wires 42 and62 into the metal bump 10 to form the same packaging structure.

Next, another packaging structure will be described as a tenthembodiment.

FIG. 11 is a schematic sectional view showing an essential part of thepackaging structure according to the tenth embodiment. In FIG. 11, thesame elements as those shown in FIGS. 1 and 7 are indicated by the samereference numerals as in FIGS. 1 and 7 and the detailed description isomitted. Further, the irregularity formed in the electrode pad 6 shownin FIG. 7 is not shown.

A packaging structure 100 according to the tenth embodiment has thefollowing structure. That is, by changing the metal wire 62 according tothe sixth embodiment to a metal bump 62 a, a FeRAM element 60 a ismounted on an interposer 101 by the bump junction. Further, these aresealed with a sealing resin 102 such as an epoxy resin.

The interposer 101 has a structure that on the surfaces of and/or in theinsides of insulating substrates 101 a and 101 b such as a glass epoxysubstrate, an electrode pad 101 c and a connection via 101 d are formed.The electrode pad 101 c is formed at a position corresponding to themetal bump 62 a of the FeRAM element 60 a. Further, one end of theconnection via 71 d is connected to the electrode pad 10 c. Further, onthe other end of the connection via 101 d, a solder ball 103 is providedas an external connection terminal.

When using such a packaging structure 100, there can be realized ahigh-performance semiconductor device including the FeRAM element 60 awith high moisture resistance and high reliability, in which thepotential inversion abnormality is effectively suppressed.

Next, another packaging structure will be described as an eleventhembodiment.

FIG. 12 is a schematic sectional view showing an essential part of thepackaging structure according to the eleventh embodiment. In FIG. 12,the same elements as those shown in FIGS. 1 and 7 are indicated by thesame reference numerals as in FIGS. 1 and 7 and the detailed descriptionis omitted. Further, the irregularity formed in the electrode pad 6shown in FIG. 7 is not shown.

A packaging structure 110 according to the eleventh embodiment has thefollowing structure. That is, the FeRAM element 60 according to thesixth embodiment is mounted, for example, on an interposer 111 throughthe wire bonding. Further, these are sealed with a sealing resin 112such as an epoxy resin.

The interposer 111 has a structure that on the surfaces of and/or in theinsides of insulating substrates 111 a and 111 b such as a glass epoxysubstrate, a wiring 111 c formed between the substrates 111 a and 111 bas well as a connection via 111 d of which one end is connected to thewiring 111 c are formed. On the other end of the connection via 111 d, asolder ball 113 is formed as an external connection terminal.

The packaging structure 110 according to the eleventh embodiment isconstituted as follows. That is, connection between the electrode pad 6of the FeRAM element 60 mounted on the interposer 111 and an electrodepad 111 e on the interposer 111 having the wiring 111 c partiallyexposed from the substrate 111 a is performed through the metal wire 62.Then, these are sealed with the sealing resin 112.

When using such a packaging structure 110, there can be realized ahigh-performance semiconductor device including the FeRAM element 60with high moisture resistance and high reliability, in which thepotential inversion abnormality is effectively suppressed.

Next, another packaging structure will be further described as a twelfthembodiment.

FIG. 13 is a schematic sectional view showing an essential part of thepackaging structure according to the twelfth embodiment.

In FIG. 13, the same elements as those shown in FIGS. 1 and 6 areindicated by the same reference numerals as in FIGS. 1 and 6, and thedetailed description is omitted. Further, the irregularity formed in theelectrode pad 6 shown in FIG. 6 is not shown.

A packaging structure 120 according to the twelfth embodiment has thefollowing structure. That is, the FeRAM element 50 according to thefifth embodiment is mounted, for example, on an interposer 121 by thewire bonding. Further, these are sealed with a sealing resin 122 such asan epoxy resin.

The interposer 121 has a structure that on the surfaces of and/or in theinsides of insulating substrates 121 a and 121 b such as a glass epoxysubstrate, a wiring 121 c formed between the substrates 121 a and 121 bas well as a connection via 121 d of which one end is connected to thewiring 121 c is formed. On the other end of the connection via 121 d, asolder ball 123 is formed as an external connection terminal.

The packaging structure 120 according to the eleventh embodiment isconstituted as follows. That is, connection between the metal bump 51 ofthe FeRAM element 50 mounted on the interposer 121 and an electrode pad121 e on the interposer 121 having the wiring 121 c partially exposedfrom the substrate 121 a is performed through the metal wire 124.Further, these are sealed with the sealing resin 122.

When using such a packaging structure 120, there can be realized ahigh-performance semiconductor device including the FeRAM element 50with high moisture resistance and high reliability, in which thepotential inversion abnormality is effectively suppressed.

As described above, in the present embodiment, the electrode pad of theFeRAM element and the region from the electrode pad to an opening outerperiphery of the protective film is covered with a conductive film suchas a metal film.

Therefore, in performing a probe test using the electrode pad, even ifthe electrode pad is injured, penetration of moisture from the injuredportion can be prevented since the electrode pad is covered with theconductive film. As a result, a semiconductor device having highmoisture resistance and high reliability is realized.

Further, in mounting the semiconductor element on an external substratesuch as an interposer, a metal bump or a metal wire is connected to anelectrode pad through the conductive film. As a result, a semiconductordevice having high moisture resistance and high reliability is realized.

In the above description, a FeRAM element and a semiconductor devicehaving mounted thereon the FeRAM element are described as examples.Further, the above-described structure and formation method thereof canbe similarly applied to a variety of semiconductor devices having anelectrode pad.

In the present invention, an electrode pad having a mechanical injury iscovered with a conductive film. Therefore, penetration of moisture fromthe electrode pad is prevented as well as occurrence of abnormality dueto moisture after the penetration is effectively suppressed. As aresult, there can be realized a semiconductor device having highmoisture resistance and high reliability.

The foregoing is considered as illustrative only of the principles ofthe present invention. Further, since numerous modifications and changeswill readily occur to those skilled in the art, it is not desired tolimit the invention to the exact construction and applications shown anddescribed, and accordingly, all suitable modifications and equivalentsmay be regarded as falling within the scope of the invention in theappended claims and their equivalents.

1. A manufacturing method of a semiconductor device, comprising thesteps of: forming an electrode pad over a semiconductor substrate;bringing a probe into contact with the electrode pad; covering theelectrode pad to form a conductive film; and connecting an externalconnection terminal to the conductive film.
 2. The manufacturing methodaccording to claim 1, wherein, in the step of forming the conductivefilm, the conductive film is formed by a plurality of layers.
 3. Themanufacturing method according to claim 1, further comprising the stepof extending and forming the conductive film over an insulating layeraround the electrode pad.
 4. The manufacturing method according to claim3, wherein the conductive film is formed to cover the insulating layerin the length of at least 1 μm.
 5. The manufacturing method according toclaim 1, further comprising the step of forming, astride the insulatinglayer around the electrode pad and the end of the conductive film, apeeling preventive film for suppressing peeling of the end of theconductive film.
 6. The manufacturing method according to claim 1,further comprising the step of connecting a bump or a wire on theconductive film.
 7. The manufacturing method according to claim 1,wherein, in the step of forming the conductive film, a bump is formed asthe conductive film.
 8. A semiconductor device, comprising: asemiconductor substrate; an electrode pad provided over thesemiconductor substrate through an insulating film, the pad having amechanical injury; and a conductive film for covering the electrode pad.